SEMICON West 2016

Flexible Hybrid Electronics by Micro-Transfer-Printing- Christopher Bower, X-Celeprint (Room TechXPOT North)

14 Jul 16
2:55 PM - 3:05 PM

Tracks: Advanced Packaging Forum

Abstract:

Integrating ultra-miniaturized inorganic devices onto non-native substrates enables new kinds of products with desirable functionalities and cost structures that are inaccessible by conventional means.  Micro assembly technologies are the practical ways to make such micro-scale combinations possible.  Micro transfer printing technology (µTP) is a widely-demonstrated form of micro assembly, having demonstrated applicability in optical communications, magnetic storage, photovoltaics, and displays. The common value proposition of µTP in all of these applications is to provide a product that uses the most advantageous semiconductor devices and has the most desirable form factor. This presentation will provide an introduction to Micro-Transfer-Printing along with an overview of how the technology has been applied to flexible hybrid electronic systems.