Abstract:
With boundless emerging applications completely reliant on sensor technologies to function and deliver on their promise, IC packaging technologies have become more critical than ever. Addressing demand within IOT, automotive, wearables, and much more, we are all innovating to deliver the most advanced sensor technology portfolios to meet requirements for lower cost, smaller footprint and higher performance. During his talk, Jean-Marc Yannou will explore the landscape from a packaging perspective and present innovative solutions being evolved through deep engineering collaboration both within our industry and across the broader electronics ecosystem.