SEMICON West 2016

Prediction of Contact Mark for QFN Package- Yuanjun Shi, Twin Solutions (Room North Hall, Room 131)

12 Jul 16
2:40 PM - 3:00 PM

Tracks: Test Forum

Selected "Best Data" at BiTS 2016

Abstract:

For QFN package, it is important to design the tip style for contactors. This study investigated the relationship between contact load and contact mark in terms of contact shape, plating material. We study varies contact shape against of bulk sn alloy and NiPdAu alloy.  A coupled finite element analysis is performed to calculate the indention mark and indention depth: an elasto-plastic model is used to determine the geometry of the contact area. Results of simulation are compared to experimental data. The respective contributions of the mechanical phenomena are analyzed. Thus it has become possible to predict a load-contact mark.