Abstract:
Both SiP and FOWLP are seeing widespread interest across a broad spectrum of device types and are emerging as important and rapidly growing packaging solutions. Within this market space, there has been a proliferation of packaging options. This presentation will review the requirements for BEOL and assembly equipment for the latest SiP and FOWLP packaging technologies. The wide spectrum of package types demand a wide range of features and capabilities on the assembly equipment, such as face-up/face-down, heated stage, heated/unheated bondhead, low/high force, medium/high accuracy and bonding to organic substrate/wafer or even pane. Throughput and COO must, of course, be as high as possible. The relationship of the package type and specification will be presented, as well as the challenges posed by the variety of needed capabilities.
FOWLP is becoming one of the leading platforms for supporting SiP, where individual die are embedded in mold compound and linked together via single or multi-level RDL. FOWLP is the fastest growing packaging method in the industry because packages are thinner, cost less than TSV enabled 2.5 or 3D, and display low losses for RF applications. However, the mold substrate and organic-based dielectrics used by packagers do challenge wafer processing equipment because of potential contamination, low temperature tolerance and warpage. Techniques to deal with these challenges will be presented as well as evidence of running these substrates in production.