Abstract:
High-Bandwidth-Memory is a new type of memory that promises low power consumption, and ultra-wide communication lanes to improve system level performance. HBM also leverage innovative 2.5D and 3D stacking technologies which brings in many new possibilities and challenges from test perspectives. This means different test flow and insertion points, different structures to probe on, test quality required to ensure “known-good-stack”.
This presentation will address the electrical challenges and simulation results associated with direct on MicroBump probing of wide data busses at up to 1GHz.
We will also review how MicroBumps will respond to the probe card under various probing conditions such as current, test temperature and test durations.