Abstract:
Package solutions for high-performance systems include silicon interposers and memory die stacked with through silicon vias. Mobile devices such as smartphones are the major driver for both the package development and unit volume growth in the semiconductor industry. While today’s wafer level packages (WLPs), package-on-package (PoPs), and stacked die CSPs will remain popular—along with a more traditional packages such as leadframes and ball grid arrays (BGAs), new versions of advanced packages such as fan-out WLP are emerging that change the industry’s approach to test. This presentation examines the emerging packages from the high-performance applications segment to mobile devices and provides an insight into future test requirements.