Join us in San Francisco Monday, July 11, 2016 to learn about cloud deployments for big data and high performance computing (HPC) for electronics and semiconductor engineering/manufacturing. Speakers will present use-cases and opportunities for HPC and big data on the cloud for engineering and manufacturing, with an emphasis on semiconductor, defense, or other security-critical sectors. Additionally, hear about successes with big data and HPC in other industries, learn techniques for achieving faster and more accurate results, and learn how to deploy in the cloud in secure and costeffective manner.
Topic Examples
- Best practices for managing EDA and CAE clusters in the cloud, including performance and cost optimization
- Deployment of popular applications in CAE, EDA, and materials sciences
- Workflow and data management, and ISV license management
- IT governance, including data security and secure global collaboration
Who Should Attend
- Senior Management and Industry Executives from Electronics Design and Manufacturing companies - including IDM’s, Foundries, Fabless, Design Houses, OEM Equipment Companies, and EMS
- CIOs, CTOs, Data Engineers and Managers, Data Warehouse Developers, Big Data Architects, BI Managers, and Data Engineers
- Marketing personnel as well as engineers and other technical personnel seeking to learn more about Big Data & Cloud Computing use, implementations and net benefits across diverse industry sectors
- Smart Manufacturing Suppliers and System Integrators
Registration
SEMI Member $50.00
Non Member $50.00
