SEMICON West 2016

Sessions Speakers Exhibitors Products Press Releases Floor Plan Buzz

Innovations in SiP & Heterogeneous Integration - William T. Chen, ASE Group (Room San Francisco Marriott Marquis)

11 Jul 16
4:30 PM - 5:00 PM

Tracks: Market Symposium, Global Business Outlook

During his presentation, William (Bill) Chen will discuss the crucial role of the heterogeneous integration through SiP, increasingly being applied within the broad electronic device market and quickly meeting the challenges associated with the emerging internet of things (IoT) and migration to the cloud. Chen will explore the re-invention of core packaging technologies and the emergence of new innovations as platforms for SiP.  In tracing the evolution of Fan Out from Fan In packages and the emergence of 2.5D , he will then demonstrate how this new set of core technologies has great potential to meet the complex challenges of integration and miniaturization posed by a highly demanding market place.