Tracks: Flexible Hybrid Electronics Forum
Abstract:
Flexible hybrid integration of printed electronics and physically flexible silicon has become the preferred solution for flexible system commercialization. Leading edge approaches for integrating silicon devices with printed features have identified problems and obstacles that must be resolved for commercially viable hybrid systems. This presentation will look at recent advances Flexible Hybrid Electronics system design and reliability. System design will discuss flexible circuit board design flows and design rule considerations. FHE reliability will discuss initial data, issues, as well as standards and procedures. The talk will conclude with a discussion of thin semiconductor device capabilities and opportunities.