Abstract:
Wide band gap devices are changing the way that power is converted and processed. With benefits like lower losses, high switching frequencies, higher voltage blocking and higher operating temperatures, wide band gap device package structures, materials, attaches, and interconnection methods are working to increase system performance while reducing size and weight. The advantages of wide band gap devices create numerous packaging challenges, greater attention must be paid to package parasitics, material properties, and all thermal-electrical-mechanical properties of the package. This presentation will give a brief overview of the benefits of SiC & GaN power devices, review some of the module packaging challenges for these devices, introduce the parametric model approach, and show an example wide band gap power electronics system for electric vehicles.