Abstract:
The major enabler for next generation higher density power electronics packaging is 3D packaging technology utilizing embedded power passive and active components. Although intermediate steps toward embedding some of these components, especially active type, is obvious and rather straight forward, both the materials scientists and the power electronics designers still view embedding the power passive components as challenging and only remotely possible. This presentation identifies selected technology gaps to achieve fully embedded power converters and proposes some developing gap-closing solutions meant to challenge both the developers of enabling materials and process technologies, and the power electronics industry. This work is an extension of my co-authorship of technology report, “Current Developments in 3D Packaging With Focus on Embedded Substrate Technologies,” published in March 2015 by Power Sources Manufacturers Association (PSMA).