Abstract:
Flexible hybrid electronics is built around the concept of combining and in some cases modifying effective existing technologies to integrate with flexible circuit technology, printed interconnect and more novel printed device technologies such as large area sensors, energy harvesting and energy storage. This is being pursued as a means to end; to achieve an integrated system with all the desired properties such as wireless connectivity, thinness, the ability to be robustly implemented in truly flexible applications, and low cost in the present manufacturing technology environment where some of those functions cannot yet be realized with emerging flexible and printed electronics components or, more simply, a better outcome can be realized more quickly through hybridized systems that take advantage of characteristics of existing and new flexible electronics technology. This can be due to lacking capabilities in device switching speed, parasitics, degree of large scale integration (LSI), operating voltage, or power consumption, cost/area, and cost vs. scale of manufacturing for example. To meet the needs of industrial, defense, mobile electronics and some consumer applications, flexible hybrid electronics has already happened at some level. Examples include bare die chip on flex interconnect display drivers, RFID or smart card assemblies. The successful efforts in FHE so far, however, have mostly sought to combine the existing components in their pre-existing forms and issues such as true FHE system design, robust flexibility for applications such as wearables, and manufacturing that is optimized towards what is possible, are in their infancy.
Universities have played an important role in the development of materials, components and isolated processes that already exist. Now we are also seeing new efforts and more integrated efforts on the academic side to address issues such as additive and scalable manufacturing approaches for integrated printed electronic systems and flexible energy devices which are ubiquitously needed in FHE. Along with this there has also been the emergence of translational research centers and testbeds at Universities that can facilitate and enhance FHE technologies, applications and workforce development. Although industry is often thought of as the primary way to achieve focused and rapid development of products and manufacturing processes, FHE development can sometimes be perceived as too high a risk or a potential disruption to running manufacturing processes in small and large companies. In addition to basic device, materials and process research on campus, University centers can facilitate prototyping, scaled process development, small pilot manufacturing, analysis and testing. The most focused of these centers have industrial and academic collaborations and access as part of their principle mission. These capabilities may overcome barriers such as requirements for special environments, space, large capital investments or long lead times that can prevent manufacturing and design-focused companies from pursuing FHE development and implementation. For the academic side, these centers can be sources of direct funding or catalyze industrial/academic grant partnerships, such as those supported be the NextFlex FHE Manufacturing Innovation Institute. These centers can also expose and focus student and faculty to current industrial challenges. Examples of basic device research and FHE-related centers and how they can accelerate getting to a viable FHE industry.