Abstract:
Smart manufacturing has been described as the integration of information, technology and ingenuity to bring about the rapid development and application of intelligence to every aspect of a manufacturing operation. Today the concept is becoming what “lean manufacturing” was to the 1990s. In the semiconductor industry, smart manufacturing takes many forms, from intelligent manufacturing tools, to traceability in the supply chain, or data analytics for prediction and control. This presentation addresses two ways Amkor is implementing smart manufacturing concepts in its assembly, packaging and test flow. First, we will describe the development of new package assembly design kits that use modeling and simulation to prove packaging platforms prior to making significant investments in new designs. We will also describe a cost-efficient infrastructure based on configurable manufacturing lines that enable many customers to use the same platforms for assembly, package and test of diverse device types.