Abstract:
While the Internet of Things (IoT) promises to be a major growth driver for the semiconductor industry, the projected tens of billions of interconnected devices will be vulnerable to cyber breaches on an extraordinary scale with unthinkable ramifications.
Targets for malicious intrusion encompass virtually every Internet access point. Software security has been applied to the Internet at multiple levels, but has not deterred cyberattacks. To meet the ominous IoT security challenges, experts agree that device-embedded security will also be needed.
Device-embedded security has been attempted with programmable fuses or non-volatile memory. Unfortunately, fuse-programmable ICs expose data written to the chip, while “non-volatile” solutions such as Flash are in fact volatile, with data retention times of about five years. This may be acceptable for fleeting consumer products, but it is inadequate for devices used in applications that must endure for decades.
Help is on the way with a new directed electron writing (DEW) technology that inserts chip-specific information into each IoT device cost-efficiently and rapidly during high volume manufacturing. Significantly, security data is embedded in each chip in ways similar to patterning via holes in the metallization layers. Such on-chip security, unique to each IC, is implemented during production regardless of the design layout style.
DEW on-chip security information includes a chip ID, a communication address, and private key encryption. The IP address facilitates Internet communication, and encryption ensures secure authentication. Embedding a chip ID also protects against IC counterfeiting and enables supply chain traceability.
This presentation will:
- Chart the rising security issues facing the semiconductor industry in the IoT sector
- Evaluate and compare current device-level security solutions
- Disclose key elements of the technology behind a DEW-enabled security solution