Printing components (sensors, batteries, passives, TFTs and displays) onto a flexible substrate and then integrating thinned silicon devices creates a flexible hybrid electronics (FHE) platform. How will these two seemingly incompatible manufacturing methods come together to produce FHE systems for medical, structural health monitoring, IOT and other emerging markets? What are the possible fabrication and assembly approaches and associated technical challenges to realize a cost-competitive technology? What alternative solutions are available, especially from established vendors based on 2.5 or 3D technology? What features will enable competitive advantage for FHE platforms --- cost, form factor, dimensional scalability from small size to large area? In this workshop featuring subject matter experts, FlexTech Alliance will provide a "deep dive" into the technology underpinning FHE processing and packaging strategies and the potential advantages over mainstream approaches.
Registration
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By June 3
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Starting June 4
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SEMI Member
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$299
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$399
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Non Member
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$399
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$499
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