Power dissipation is increasingly becoming the dominant challenge for continued progress of computing technologies. A major component of the power dissipation comes from the interconnects which carry information among the computing units. Indeed, power dissipation scales linearly with capacitance, and the capacitance of the communicating wires dwarfs that of the transistors. Additionally, with continued scaling of the physical dimensions, today's interconnect technology faces significant challenges in terms of increased resistance, diffusion, voids just to name a few. As a result, finding new solutions to more efficient interconnect technology is becoming a topic of paramount importance and significant efforts are ongoing in both academia and industry based on new physics, material science and innovative engineering solutions. The objective of this symposium will be to convene leaders from both academia and industry and discuss challenges and potential solutions for interconnect needs of the next generation computers.
Registration
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By June 3
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Starting June 4
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SEMI Member
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$125
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$175
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Non Member
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$175
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$225
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