MEMS Sensor Packaging
(Room 204)
11 Jun 15
1:40 PM
-
2:20 PM
Tracks:
MEMS, MEMS & Sensors
The presentation will review methods of making small outlined consumer MEMS sensors like wafer thinning, bonding, TSVs and interposers for smart phones and wearables. It will also cover the more challenging packaging requirements for industrial, automotive and medical devices that involve fluid interfaces as well as pressure and temperature extremes. In this session, attendees will learn: the techniques used to make consumer MEMS-based sensors, including the limitations on shrinking the size and cost of these sensors, more about MEMS processing such as wafer to wafer bonding, thinning, vacuum packaging and TSV/TGV integration, and the difficulties encountered in with MEMS with corrosive, high pressure, liquid gas and biologic applications and interfaces.