SEMICON West 2016

Sessions (53)

Packaging Photonics for Speed & Bandwidth (Room TechXPOT North)

12 Jul 16
10:30 AM - 12:30 PM

Packaging Photonics for Speed & Bandwidth: Welcome and Introductions - Gnyaneshwar Ramakrishna, Cisco Systems (Room TechXPOT North)

12 Jul 16
10:30 AM - 10:40 AM

Heterogeneous Integration and the Photonics Packaging Roadmap- Bill Bottoms, 3MTS (Room TechXPOT North)

12 Jul 16
10:40 AM - 11:00 AM

AIM Photonics – Manufacturing Challenges for Photonic Integrated Circuits- Michael Liehr, AIM Photonics (Room TechXPOT North)

12 Jul 16
11:00 AM - 11:20 AM

IP Traffic Growth Driving Adoption of Silicon Photonics- Kaushik Patel Ph.D., Cisco Systems (Room TechXPOT North)

12 Jul 16
11:20 AM - 11:40 AM

Integrated Photonic Devices for Sensing - Benjamin Miller, University of Rochester Medical Center (Room TechXPOT North)

12 Jul 16
11:40 AM - 12:00 PM

Packaging Photonics for Speed & Bandwidth Panel Discussion (Room TechXPOT North)

12 Jul 16
12:00 PM - 12:30 PM

Packaging Power - Enabling a Variety of Applications and Efficiency (Room TechXPOT North)

12 Jul 16
2:00 PM - 4:05 PM

Packaging Power Session Introduction: Session Chairs: Dr. Luu Nguyen, Texas Instruments & Dr. F. Patrick McCluskey, University of Maryland (Room TechXPOT North)

12 Jul 16
2:00 PM - 2:10 PM

The Power Revolution- John Muth, NC State (Room TechXPOT North)

12 Jul 16
2:10 PM - 2:25 PM

Unmet Challenges of Embedded Components for 3D Power Electronics Packaging- Arnold Alderman, Anagenesis (Room TechXPOT North)

12 Jul 16
2:25 PM - 2:40 PM

Power Electronic Systems Utilizing High Performance Silicon Carbide Power Modules; Packaging Design & Challenges, System Benefits & Opportunities- Jared Hornberger, Wolfspeed (Room TechXPOT North)

12 Jul 16
2:40 PM - 2:55 PM

Thermal Design for Dynamic Products- John Wilson, Mentor Graphics (Room TechXPOT North)

12 Jul 16
2:55 PM - 3:10 PM

Power Solution by Device Embedding- Jean-Marc Yannou, ASE (Room TechXPOT North)

12 Jul 16
3:10 PM - 3:25 PM

Packaging Power - Enabling a Variety of Applications and Efficiency Panel Discussion – All Speakers (Room TechXPOT North)

12 Jul 16
3:25 PM - 4:00 PM

Packaging Power Session Wrap-Up: Session Chair: Dr. Luu Nguyen, Texas Instruments (Room TechXPOT North)

12 Jul 16
4:00 PM - 4:05 PM

SiP Next 1 – Processor - Memory/Analog Integration (Room TechXPOT North)

13 Jul 16
10:30 AM - 12:35 PM

SiP Next 1 – Processor - Memory/Analog Integration Session Introduction- William Chen, ASE Group (Room TechXPOT North)

13 Jul 16
10:30 AM - 10:40 AM

Technologies for the Next Generations of Computing- John Knickerbocker, IBM TJ Watson Research Center (Room TechXPOT North)

13 Jul 16
10:40 AM - 11:00 AM

WLSI for Heterogeneous System Integration- Doug Yu, TSMC (Room TechXPOT North)

13 Jul 16
11:00 AM - 11:15 AM

System Level Co-optimizations for 2.5D/3D Hybrid Integration of High Performance Computing System with GPU and HBM2- John Hu, NVidia (Room TechXPOT North)

13 Jul 16
11:15 AM - 11:30 AM

2.5D & Fanout, and Their Pivotal Role in SiP Technology- CP Hung, ASE (Room TechXPOT North)

13 Jul 16
11:30 AM - 11:45 AM

Chartering the Heterogeneous Integration Roadmap - William Chen, ASE Group & Bill Bottoms, Third Millennium Test Solutions (Room TechXPOT North)

13 Jul 16
11:45 AM - 12:00 PM

SiP Next 1 – Processor - Memory/Analog Integration Panel Discussion (Room TechXPOT North)

13 Jul 16
12:00 PM - 12:30 PM

SiP Next 1 – Processor - Memory/Analog Integration Session Wrap-Up- Jean Trewhella, GLOBALFOUNDRIES (Room TechXPOT North)

13 Jul 16
12:30 PM - 12:35 PM

SiP Next 2 - IoT & Smart Things - SiP Integration (Room TechXPOT North)

13 Jul 16
2:00 PM - 4:10 PM

SiP Next 2 - IoT & Smart Things - SiP Integration Welcome- Li Li, Cisco Systems (Room TechXPOT North)

13 Jul 16
2:00 PM - 2:05 PM

When Robots See…- Anders Grunnet-Jepsen, Intel (Room TechXPOT North)

13 Jul 16
2:05 PM - 2:30 PM

Opportunities for Integration in IoT- Ivor Barber, Xilinx (Room TechXPOT North)

13 Jul 16
2:30 PM - 2:45 PM

Smart Things Require Smart Packaging- David Bolognia, Analog Devices (Room TechXPOT North)

13 Jul 16
2:45 PM - 3:00 PM

Enabling Technologies for IoT Sensor Nodes- Jean Philippe Polizzi, CEA-Leti (Room TechXPOT North)

13 Jul 16
3:00 PM - 3:15 PM

Assembly Equipment for Advanced Packaging- David Butler, SPTS & Bob Chylak, KNS (Room TechXPOT North)

13 Jul 16
3:15 PM - 3:35 PM

SiP Next 2 - IoT & Smart Things - SiP Integration Panel - All Speakers (Room TechXPOT North)

13 Jul 16
3:35 PM - 4:05 PM

SiP Next 2 - IoT & Smart Things - SiP Integration Session Wrap-up - Dongkai Shangguan, STATS ChipPAC (Room TechXPOT North)

13 Jul 16
4:05 PM - 4:10 PM

Sensing the Future: Enabling Applications for a Smarter World (Room TechXPOT North)

14 Jul 16
10:30 AM - 12:30 PM

Sensing the Future: Enabling Applications for a Smarter World-Session Introduction- Marc Papageorge (SPEC Sensors), Rich Rice (ASE), Jim Walker (Gartner) (Room TechXPOT North)

14 Jul 16
10:30 AM - 10:35 AM

IoT Opportunity- Sameer Sharma, Intel (Room TechXPOT North)

14 Jul 16
10:35 AM - 11:05 AM

MEMS & Sensors Packaging : Technology and Market Trends- Amandine Pizzagalli, Yole Développement (Room TechXPOT North)

14 Jul 16
11:05 AM - 11:25 AM

Orchestrating Packaging Technologies for an Extra Sensory World- Jean-Marc Yannou, ASE (Room TechXPOT North)

14 Jul 16
11:25 AM - 11:45 AM

Joseph Stetter, SPEC Sensors (Room TechXPOT North)

14 Jul 16
11:45 AM - 12:05 PM

MEMS and Sensors Packaging – Leveraging More Than Moore Concepts- Steve Groothuis, Samtec (Room TechXPOT North)

14 Jul 16
12:05 PM - 12:25 PM

Sensing the Future: Enabling Applications for a Smarter World- Session Wrap Up (Room TechXPOT North)

14 Jul 16
12:25 PM - 12:30 PM

Packaging Developments for Flexible Hybrid Electronics (Room TechXPOT North)

14 Jul 16
2:00 PM - 4:00 PM

Packaging Developments for Flexible Hybrid Electronics- Welcome- Mark Poliks, Binghamton University and Sesh Ramaswami, AMAT (Room TechXPOT North)

14 Jul 16
2:00 PM - 2:05 PM

What Does “Packaging” Mean in an FHE System?- Jason Marsh, NextFlex (Room TechXPOT North)

14 Jul 16
2:05 PM - 2:15 PM

Trends in Advanced Packaging- Urmi Ray, Qualcomm (Room TechXPOT North)

14 Jul 16
2:15 PM - 2:25 PM

Lockheed Martin Priorities for FHE and Printed Electronics- Jeff Stuart, Lockheed Martin (Room TechXPOT North)

14 Jul 16
2:25 PM - 2:35 PM

Challenges of Complex System Integration in Flexible Hybrid Electronics- Nancy Stoffel, General Electric (Room TechXPOT North)

14 Jul 16
2:35 PM - 2:45 PM

Uniqarta Flexible Hybrid Electronics Assembly Technology- Ronn Kliger, Uniqarta (Room TechXPOT North)

14 Jul 16
2:45 PM - 2:55 PM

Flexible Hybrid Electronics by Micro-Transfer-Printing- Christopher Bower, X-Celeprint (Room TechXPOT North)

14 Jul 16
2:55 PM - 3:05 PM

Developing the Next Generation Catheter- Denis Barbini, Universal Instruments (Room TechXPOT North)

14 Jul 16
3:05 PM - 3:15 PM

Packaging Developments for Flexible Hybrid Electronics Panel- All Speakers (Room TechXPOT North)

14 Jul 16
3:15 PM - 3:55 PM

Packaging Developments for Flexible Hybrid Electronics- Closing Remarks- Mark Poliks, Binghamton University and Sesh Ramaswami, AMAT (Room TechXPOT North)

14 Jul 16
3:55 PM - 4:00 PM