Royce Instruments and V-TEK International introduce new AP+
Highly customizable die sort solution offers multiple wafer and tray input options, adds output to tape and reel or tray.
NAPA, California, U.S.A., September 14, 2016 -- Royce Instruments and V-TEK International today announced the release of their new automated die sorter, the AP+. The AP+ will be showcased at the upcoming IMAPS 2016 Symposium on Microelectronics in Pasadena, California from October 10-13, 2016. With over 30 years in the electronic component processing and packaging industry, Royce and V-TEK each bring a wealth of experience to the design table. The result is the AP+, a flexible solution that merges Royce’s capability of processing highly sensitive die with V-TEK’s most advanced taping technology. The highly customizable AP+ offers a variety of automated input and output options while maintaining fast change-over between processes. Die input is from wafer, waffle pack, Gel-Pak, JEDEC tray or custom tray using an input map. Output options are the same with the addition of a new tape and reel system. The AP+ taper features an adjustable width track with heat and pressure seal options. Die Sort Manager Software provides input to output traceability at the die level. Die Sort modes include pizza map or reticle mask wafer mapping, ink dot recognition and pick all die. AP+ options include non-surface die pick-up, 180 degree die flip and taper post-place vision inspection. With its multi-project wafer mapping capability and quick-change fixtures and tooling, the AP+ is ideal for supporting medium volume, high mix environments.
For more information on the AP+, please contact:
Bill Coney
Business Development Manager
Royce Instruments, LLC
831 Latour CT, Suite C
Napa, CA 94558
707.975.2846
bconey@royceinstruments.com