Garching, 10. July 2017 - SUSS MicroTec, a leading manufacturer of systems and process solutions for the semiconductor industry and related markets, posted a significantly higher order intake in the first half of 2017 compared to the previous year. Orders of EUR 69.3 million were booked in the first half of 2016, whereas orders in the first half of 2017 are expected to be around EUR 94 million, an increase of approximately 36 percent.
The improved demand for SUSS MicroTec products is on the one hand due to the overall good market situation in the semiconductor industry. On the other hand, the Company was successful in bringing its innovative solutions to the customer, particularly temporary bonding systems as well as UV projection scanners. The core area of lithography with its Mask Aligners and Coaters/Developers also recorded full order books in the first half of the year. The customer demand originates from the end markets of consumer electronics and communications.
The temporary bonding systems were ordered by an internationally leading IDM (Integrated Device Manufacturer), which already uses several of the systems in its production. With the current order, the customer expands his existing production capacities significantly. The machines are configured for the temporary bonding of 300 mm wafers for 3D-TSV integration processes in logic and memory applications. At this point of time, SUSS MicroTec is expecting further revival in the area of 3D-TSV integration.
In addition, SUSS MicroTec was able to win a follow-up order for two UV projection scanners DSC300 Gen2 in the first half of 2017. The customer, a leading foundry in Asia, already uses several UV projection scanners in its volume production. With the purchase of two additional systems, which have been in use at the customer's site since 2016, the customer is adding production capacity of this very cost efficient exposure solution. Other customers from the semiconductor industry have already expressed great interest in the next generation of the DSC300. The new product generation will offer major improvements in throughput and overlay accuracy compared to the previous model. The new generation of DSC300 is expected to be launched in the second quarter of 2018. An upgrade version for existing tools is planned to be available in the fourth quarter of 2017. This will allow customers to equip their existing DSC300 systems with some of the improvements.
"We are very satisfied with the business development in the first half of 2017", says Dr. Franz Richter, Chief Executive Officer of SUSS MicroTec. "Since the fourth quarter of 2016, we have seen a significant recovery in business in all our segments, and I am confident that the positive development will continue in the second half of the year."
For more information visit: www.suss.com
Contact:
SUSS MicroTec AG
Franka Schielke
Senior Manager Investor Relations
Schleissheimer Strasse 90
85748 Garching, Deutschland
franka.schielke@suss.com
Tel.: +49 89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke@suss.com