Bernin, FRANCE (March 07th, 2016) – Plasma etch and deposition equipment maker CORIAL extends the capabilities of the Corial 200I ICP system with etching processes targeted specifically at deprocessing of devices down to 20 nm.
In the Failure Analysis flow, dry etch is the reference technology for sample deprocessing before any physical investigation of the device, to reveal a defect and identify its root cause. Deprocessing is a challenging step as the device must retain electrical integrity and its surface must remain planar for further tests. “For more than ten years, CORIAL drives innovation in Failure Analysis for the semiconductor industry”, said Elsa Bernard-Moulin, Marketing Manager, CORIAL. “Our core competences include tight adjustment of etch profile, over etch prevention for full retention of electrical integrity, and development of chemistries delivering planar etching without residues.”
CORIAL has developed a variety of processes to enable removal of polyimide, silicon nitride, silicon oxide, ILD, low & ultra-low K layers and metal (Al). As an example, we demonstrated the capability to expose many layers of metal with SiO2 etch rate as high as 0.2 μm/min while leaving no residue on the sample surface.
CORIAL leverages a concept of universal shuttle, enabling deprocessing of dies, packaged dies and wafers up to 200 mm, with only one etch equipment and no need for changing pieces of the reactor chamber to switch between sample types. The Corial 200I is built upon a production-proven technology with an inductively coupled plasma (ICP) source capable for low plasma potential and tight control of very low bias voltage, giving rise to minimum damage of metal lines. This etch system is fully automated, delivering stable processes with simple operation and minimum maintenance.
For more information, please contact Elsa Bernard-Moulin at e-bernard-moulin@corial.net
About CORIAL
CORIAL is a manufacturer of plasma etch and deposition equipment which contributes to innovation in wafer processing for the semiconductor industry. CORIAL addresses a range of end-market applications including MEMS, LED, Advanced Packaging, Failure Analysis, and Wireless Devices. The technologies offered by CORIAL include RIE, ICP, ICP-CVD, and PECVD. With unique features such as precise process control for damage free etch, stress free deposition, or in-situ plasma reactor cleaning for the highest industry uptimes, CORIAL is committed to deliver the highest repeatability with the lowest cost of ownership.
CORIAL equipment are designed and manufactured in France.