Posted on June 13, 2016
Members of FlexTech Alliance join expert panels and sessions to share insights on evolving flexible circuit market.
MELVILLE, N.Y., June 6, 2016 — BZ Media LLC announced today that members of the FlexTech Alliance™, Heidi Hoffman, Senior Director of the FlexTech Group and Melissa Grupen-Shemansky, Chief Technology Officer of the FlexTech Group, will join Wearables TechCon™ faculty at the San Jose Convention Center, July 18-20. Hoffman will moderate the Flexible Circuits Enabling the Wearable Revolution panel which will feature Grupen-Shemansky and Jason Marsh, Director of Technology at NextFlex, sharing their perspectives on the evolution of flexible circuits and their role in the next phase of wearable tech.
The FlexTech Alliance provides advocacy and support for companies developing flexible electronics products and technologies. Since 1994, they have played a leading role in the growth of flexible circuits. “We have been quietly helping build the un-sexy part of the wearables community for years with our work in flexible electronics, microfluidics, printing sensors, etc. I am looking forward to Wearables TechCon for the opportunity to share our thoughts on the challenges and opportunities to developing and manufacturing the building blocks for high-end technology,” said Hoffman.
In addition to the flexible circuits panel, Wearables TechCon will include classes on other forms of wearables beyond the common smartwatch formfactor such as “The Hardest Wearables Are the Soft Ones: Challenges and Opportunities for Smart Textiles” and “System-on-Chip Innovation: The Catalyst for Next-Generation Sports and Fitness Wearables.”
“Sometimes people think wearables are only smartwatches and pedometers, but some of the most innovative implementations of the technology can be worn like a t-shirt or fit in the sole of your shoe,” said Katie Flash, Conference Program Director for Wearables TechCon and Internet of Things TechCon.
Wearables TechCon returns for its third year with an expanded program and the addition of a new co-located conference Internet of Things TechCon. The two conferences will share an exhibit hall with 55+ leading vendors showcasing the latest in sensor-based tech, flexible and textile circuits, wearable and IoT components, and backend services.
Registration for Wearables TechCon—for developers, designers, builders, business decision makers and OEMs driving the next generation of wearables and the Internet of Things—is now open at www.wearablestechcon.com. Receive $100 discount off a ticket by using the code FLEX.