Chandler, AZ -- June 16, 2016 - Axus Technology of Chandler, Arizona is pleased to introduce the G&P POLI-1300PCB Planarization Tool for large format substrates greater than 500mm on a side. The POLI-1300PCB was developed to address the growing requirement for inter-layer planarization of dielectric, epoxy, and metal films on large format substrates, including fan-out boards and similar products.
The tool includes automated process controls and the large format carrier and platen needed to planarize these large substrates. The temperature-controlled platen also supports through-the-table slurry delivery, ensuring efficient delivery and slurry usage.
The POLI-1300PCB is manufactured by G&P Technology in Korea and distributed in North America by Axus Technology. Process demonstrations are available in Axus' Chandler, AZ facility.
"Where we have previously custom-configured CMP tools for large substrate applications, the G&P POLI-1300PCB is specifically designed for the application, making it a much more efficient platform," says Dr. Peter Wrschka, Axus Technology's Director of Process Technology. "The POLI-1300PCB builds on well-established methods of CMP process technology adapted to deliver improved uniformity and repeatability for these large substrates.”